Alumina filler waste as clay replacement material for unfired brick production

Clay as sealing material in nuclear waste repositories

some agent. This agent is usually water, which can transport the radionuclides in dissolved form or in colloids or small particles. We can therefore establish that a basic characteristic of a safe repository is for it be impermeable, that is, water should not be able to penetrate it. At this stage it is appropriate to consider the physical form in which the waste will be taken to the repository...

Utilization of Alumina Waste and Silica Waste for Geopolymer Production

This research studies the utilization of alumina waste and silica waste for geopolymer production. Alumina waste was obtained from aluminium thermal metallurgy industry, silica waste was obtained from silicone recycle industry in Thailand. This present study aimed at investigating the basic physical and chemical properties of waste materials and also the optimal proportion in geopolymer product...

CTAB as a soft template for modified clay as filler in active packaging

The role of modified clay has been employed in many areas of engineering research. Structure of clay was mainly focused on alumino-silicate layer and its form was presented as pillar layer. It composed of many ion exchanges inside. In industry, in order to use clay with higher efficiency, modification on surface and porosity has been developed. CTAB, one of the most effective cationic surfactan...

NESHAP for Brick and Structural Clay Products Manufacturing; and NESHAP for Clay Ceramics Manufacturing: Correction

(ii) [Reserved] (b) Specific requirements. The provisions of subpart A of this part apply to this section except as modified by this paragraph. (1) Recordkeeping. Recordkeeping requirements as specified in § 721.125(a), (b), (c), (i) and (k) are applicable to manufacturers and processors of these substances. (2) Limitations or revocation of certain notification requirements. The provisions of §...

Fumed-Alumina-Derived Nanoporous Alumina as a New Low-k Dielectric Material for Microelectronics Packaging